Plasma wafer etching machine - M-8000 series - Hitachi High-Tech Europe GmbH - for the microelectronics industry

Conductor Etch System M-8000 Series is utilized for hard mask and silicon etching for 32nm and beyond. Hitachi High-Tech developed new process flows, such as double patterning and new material etch processes such as high-k dielectric/metal gate through JDP (Joint Development Program) with device
Conductor Etch System M-8000 Series is utilized for hard mask and silicon etching for 32nm and beyond. Hitachi High-Tech developed new process flows, such as double patterning and new material etch processes such as high-k dielectric/metal gate

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