Diamond Cutting Wheels for ULTILE Precision Glass and Wafer Cutters– MSE Supplies LLC
Product Descriptions Diamond Cutting Wheels Options for ULTILE Precision Glass and Wafer Cutters There are four different Diamond cutting wheels available for use on harder materials (such as sapphire, YSZ, etc.) ranging from 0.15 mm to 3.0 mm in thickness. Four different Carbide cutting wheels are also available to handle standard materials from 0.15 mm up to 3 mm in thickness. These cutting wheels are ordered together with new cutters or as replacement cutting wheels. The ULTILE Precision Glass and Wafer Cutters are the highest precision lab scale glass and wafer cutters that provide the best possible edge quality after cutting. These glass and wafer cutting tools have an ergonomic design for the ease-of-use for the users to quickly and easily cut larger size glass, crystal substrates and semiconductor wafers into smaller pieces. The cutters can be equipped with either
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Product Descriptions Diamond Cutting Wheels Options for ULTILE Precision Glass and Wafer Cutters There are four different Diamond cutting wheels available for use on harder materials (such as sapphire, YSZ, etc.) ranging from 0.15 mm to 3.0 mm in thickness. Four different Carbide cutting wheels are also available to handle
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Product Descriptions The ULTILE Precision Glass and Wafer Cutters are the highest precision lab scale glass and wafer cutters that provide the best
ULTILE Precision Wafer and Glass Cutting Tools
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